February 6, 2018
Webinar March 1 - ANSYS 19 - Icepak Product Update
Date: March, 01 2018
Time: 17:00 CET (Central European time)
Electronic devices today contain many more components within a much smaller form factor than ever before. Even though advances have been made with smaller processor technologies to decrease power draw, the need to predict heat dissipation is now as important as the electrical design itself. More and more layout designs are being done alongside thermal analysis. Attend this webinar to learn how ANSYS 19 integrates the ANSYS Icepak electronics cooling product directly into the ANSYS Electronics Desktop. This advancement modernizes and enhances the workflow that our electronics customers are already using. It opens new possibilities for component and system-level multiphysics, automation and robust design. Icepak is in the Electronics Desktop alongside ANSYS HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother, more robust overall workflow for thermal analysis coupled to electromagnetics. Register now to learn about Improvements to the SIwave <--> Icepak solution for ECAD, including automated report generation that helps maximize customer design efficiency.