ANSYS Icepak 2019.1 Product Update
Join us to learn about the new capabilities available in Icepak 2019.1. The new release includes powerful new features for the design of electronics cooling strategies and electro-thermal analysis. New features include:
- Electro-thermal analysis — Two-way closed loop coupling between HFSS, Maxwell, Q3D Extractor and Icepak
- Modeling of inclined PCB
- DCIR EM loss coupling
Don’t miss this webinar detailing all the significant advancements in Icepak.
Time: 17.00 CET (Central European time)
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