Multiphysics Optimization of Electronics Systems Using ANSYS Icepak, ANSYS Mechanical and ANSYS optiSLang
Electronics systems are becoming more and more compact, requiring sophisticated optimization techniques to achieve optimal performance. Faced with the growing complexity of the design space, engineers are challenged to identify the key variables that need to be optimized. ANSYS multiphysics simulations help them to meet these challenges.
This webinar will demonstrate a multiphysics simulation procedure for the optimization of the thermo-mechanical characteristics of an electronics system. The analysis requires a well-parametrized geometry and an automated workflow. ANSYS Icepak and ANSYS Mechanical will perform two-way thermo-mechanical multiphysics simulations, and ANSYS optiSLang will optimize the design for minimal heat sink mass, fan flow rate and thermal stress, while controlling the temperature within specified limits.
Time: 17.00-18.00 CET (Central European time)
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