EDRMedeso contributes to the project through expertise in modelling and simulation. The main role is to develop advanced Multiphysics simulation workflows for power electronics modules in close cooperation with ABB. These models combine electromagnetic, thermal, and structural analysis to support better design decisions, shorter development cycles, and improved reliability.
By applying simulation driven engineering to complex chip packaging challenges, we help the consortium move towards more efficient virtual prototyping and more reliable power electronics solutions.
The work supports the broader E2PACKMAN goal of enabling smaller, more powerful, and more sustainable electronic systems for future European industry.
The project also includes several Nordic technology leaders among EDRMedeso and ABB, including Okmetic Oy, Murata Electronics Oy, VTT Technical Research Centre of Finland, RISE Research Institutes of Sweden, Ericsson AB, and Sivers Semiconductors.
Together, the network is building a strong European ecosystem for advanced chip packaging, from materials and manufacturing processes to design, modelling, testing, and industrial use cases.
“Through E2PACKMAN, we are contributing our simulation expertise to one of Europe’s key innovation efforts in microelectronics, helping turn advanced engineering knowledge into practical tools for the next generation of electronic products.”
Project Team at EDRMedeso
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