Today’s electronic systems are operating closer to their physical limits than ever before. At the same time, engineering teams must deliver results faster without sacrificing accuracy. In response to these challenges, this session presents a seamless and efficient simulation approach.

During this live webinar, Juliano Mologni, Principal Product Manager for high-frequency applications at Synopsys, will demonstrate how engineers can build a cohesive, end to end simulation workflow that supports confident design decisions. Join us to hear the latest and greatest in the electromagnetic (EM) design.

Ansys SIwave enables efficient analysis of power integrity, signal integrity, and EMI for electronic packages and PCBs, supporting both frequency domain and time domain simulation of power delivery networks, crosstalk, and electromagnetic emissions. Complementing this, Ansys HFSS delivers full wave 3D electromagnetic simulation for antennas, interconnects, connectors, ICs, and complex PCB structures, enabling detailed modeling of field behavior and parasitic effects. Together with tools such as Q3D, Circuit, and Icepak, these establish a connected digital thread that links EDA data with electromagnetic and thermal verification, maintaining model consistency throughout the design process.

By adopting this connected approach, manual data transfer and model rebuilding between tools can be eliminated. Design updates instead propagate naturally across electrical, electromagnetic, and thermal domains within a unified simulation environment. Earlier visibility into performance issues enables shorter development cycles and physics-based, simulation-driven decisions instead of late-stage testing, ultimately delivering a better end result.

 

After this session, your team will know how to:

  • Move from test-driven workflows to simulation-driven design
  • Maintain data continuity across electrical, electromagnetic, and thermal analysis
  • Accelerate design iterations and identify performance issues earlier in the design cycle
  • Improve EMC robustness
  • Increase thermal reliability and product confidence

 

Who should attend?

  • Engineers and technical specialists working with simulations
  • Electronic and PCB design engineers
  • RF and antenna design engineers
  • R&D managers and project managers responsible for product performance

 

Speaker: Juliano Mologni, Principal Product Manager, Synopsys
Simulation | EMI/EMC | Antennas | Signal Integrity | RF | Microwave | Multiphysics

Time: Thursday, February 19, 2026 14:30 pm – 15:15 pm CET

Can’t make it live? The webinar recording will be sent to all registered participants. However, the Q&A session is exclusive to live attendees, and everyone joining live is welcome to submit questions directly to our panel of top experts.