Simulation-driven design makes it possible to develop (better) products faster. Ansys Icepak is a CFD-based solution optimized for electronics thermal management, ensuring thermal integrity and reliability in applications such as IC packages, PCBs, busbars, and power electronics.

In this webinar, we will talk about capabilities and applications of Icepak in the AEDT (Ansys Electronics Desktop) environment.

Ansys Icepak is a simulation tool specifically built for electronics cooling and thermal management. If you’re working with anything that heats up and affects performance or reliability, this is the type of tool you use to understand and fix it before building hardware.

At its core, Icepak uses CFD, computational fluid dynamics, to simulate heat transfer, airflow and temperature distribution.

So instead of guessing “will this overheat?”, you can see where hot spots form, how air moves, and what cooling solution works best.

 

What attendees will learn:

  • Capabilities and applications of Icepak
  • Multiphysics couplings
  • Reduced order models (ROM)

 

Who should attend:

  • Simulation Engineers and Experts
  • Electronics Design Engineers
  • R&D Managers
  • Anyone with 45 minutes to spare

 

Speaker: Mostafa Valavi, EDRMedeso
Business Development Manager | Ph.D, Electrical Engineering