Ansys Icepak is an electronics-specific simulation tool for the thermal design management and cooling of electronics product. Based on Ansys CFD Fluent solver, Icepak is capable of predicting temperature, airflow and heat transfer in printed circuit boards, IC packages, power electronics, and electronics assemblies.
Thermal Design Management
With the ability to handle both mechanical and electrical CAD model, Icepak facilitates the solving of challenging thermal management problem and electronics products and systems. Being a part of the Ansys Electronics Desktop enables Icepak to couple and utilize Multiphysics aspects of electronics design and is able to include electromagnetic loss densities and be part of an electronics reliability workflow for predicting temperature rise in tight connection with SIWave, Ansys Mechanical and Ansys Sherlock.
Key Features
Icepak includes all models for heat transfer, including conduction, convection, and radiation for both steady state and transient analysis. Key Features include:
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal modeling.
- Package charaterization
Benefits
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