Ansys Icepak

Ansys Icepak is an electronics-specific simulation tool for the thermal design management and cooling of electronics product. Based on Ansys CFD Fluent solver, Icepak is capable of predicting temperature, airflow and heat transfer in printed circuit boards, IC packages, power electronics, and electronics assemblies.

Thermal Design Management

With the ability to handle both mechanical and electrical CAD model, Icepak facilitates the solving of challenging thermal management problem and electronics products and systems. Being a part of the Ansys Electronics Desktop enables Icepak to couple and utilize Multiphysics aspects of electronics design and is able to include electromagnetic loss densities and be part of an electronics reliability workflow for predicting temperature rise in tight connection with SIWave, Ansys Mechanical and Ansys Sherlock.

Key Features

Icepak includes all models for heat transfer, including conduction, convection, and radiation for both steady state and transient analysis. Key Features include:

  • DC joule heating analysis
  • Multiple-fluid analysis
  • Reduced order flow and thermal modeling.
  • Package charaterization


Accurate Thermal Simulations


Ansys Icepak can accurately simulate the thermal behavior of electronic components and systems, helping engineers to optimize their designs for better performance and reliability.

Faster Design Iterations


With Ansys Icepak, engineers can quickly test and optimize their designs without the need for expensive physical testing.

Cost Savings


By optimizing designs with Ansys Icepak, engineers can potentially reduce material and manufacturing costs, and improve the overall efficiency of their products.

Comprehensive Design Capabilities

Ansys Icepak offers a comprehensive set of design capabilities, including 2D and 3D thermal simulations, coupled thermal and structural analysis, and multiphysics simulation, enabling engineers to evaluate the impact of different design choices on system performance.

Speak to an Expert

Reach out to our expert for help or advice

Juha Ojanen

Technical Manager


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The integrated electronic-photonic workflow provided by Ansys to co-design and co-simulate Silicon Photonics and CMOS chips is an indispensable tool to speed up our design process and results in better chips with fewer errors and a shorter time to market

— Jinsung Youn, Research Scientist - Large-Scale Integrated Photonics / Hewlett Packard Labs

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The speed and accuracy provided by OpticStudio has made us more confident about the full performance of our optomechanical designs. We’ve used Ansys Zemax, for over 15 years. We’re always pleased with the tools they present for helping optical engineers work together effectively.

— Milan Matela, Senior R&D Optical Designer / Meopta-optika s.r.o.

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Because Ansys Speos allows us to use our 3D CAD product as an add-on, we can perform a simulation without sacrificing the accuracy. This is one of the key aspects we liked.

— Asami Yonezawa, Senior Specialist - Mazda Craftsmanship Development Group / Mazda Motor Corporation

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This is finally a super easy way to solve CFD jobs in cloud.

— Anonymous / Beta User

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This is not a competition, it is actually an opportunity to deliver what is expected of us in the near future.

— Hege Brende / CEO of Rainpower

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We have been on CARE Business for one year and just recently renewed for another year. The major benefits we see are the prompt responses of the support team, which in combination with the Training Portal are very helpful ways to resolve issues and give good tips. The Weld and Bolt toolkit for Ansys Mechanical offers many possibilities and we are aiming to set up a simulation report template with the Report Generator app. Looking ahead, we are aiming to explore the compute power of CloudConnect and Rescale which also comes with the CARE Program. We are in the process of building an analysis team. We believe the partnership which comes with CARE will be an asset during this process as well as future initiatives.

— Rebecca Jade van Linschoten, Marine Structural Analysis Engineer / Imenco AS

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The CARE Program has been valuable for us, providing additional resources and guidance when needed. It has been particularly helpful in instances where we've encountered more complex computational fluid dynamics problems. What we appreciate about the program is the support we've received when we've faced challenges. This has been useful in helping us keep our projects moving forward.

— Armin Parsian, Chief Mechanical Engineer / 1X Technologies

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Ansys Granta Selector™ has given us more knowledge about the environmental impact of our products and where we should focus our attention in the development of new ones. Ansys Granta Selector also helped us to verify whether it is sustainable for us to gather used filters from customers to optimize the recycling process.

— Alexander Hjertström / CEO & Founder / Airinum