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Airmaster cooling unit for HVAC
case-study Consumer Product SimulationIndustrial EquipmentSustainability3D DesignAnsys DiscoveryFluid Simulation (CFD) SoftwareConsultancyCustomer Care Program

Engineering the Invisible: How Airmaster Transformed Airflow Innovation Through Ansys Discovery and EDRMedeso Expertise

  When Airmaster set out to accelerate airflow innovation, the ambition went beyond adopting a new simulation tool. The real

17 Oct
event Aerospace and Defense Simulation SolutionsAntenna Design and PlacementAutonomous SystemsBattery SystemsCombustion ModelingElectric MotorsElectrificationEnergyHigh-TechIndustrial EquipmentPower ElectronicsSimulation TechnologySimulation Solutions for the Space & Satellite IndustrySustainabilityTransforming EnergyElectronic Design & Electromagnetics Simulation SoftwareStructural Analysis SoftwareComputational Fluid Dynamics (CFD) SimulationAnsys DiscoveryAnsys Mechanical FEA SoftwareFluid Simulation (CFD) SoftwareAnsys HFSSAnsys MaxwellAcademics

Ansys Student Team Meeting Nordic 2026

Ansys Student Team Meeting Nordic 2026 In-person Simulation Workshop | Gothenburg, Sweden Are you part of a Solar, Formula, Rocketry,

17 Sep
event

Evertiq | Electronics Industry Expo in Gothenburg

EDRMedeso Exhibiting at Evertiq Sweden’s biggest one-day electronics industry expo in Gothenburg 17 September 2026, 09:00 to 16:00, Swedish Exhibition

webinar Simulation TechnologyElectronic Design & Electromagnetics Simulation SoftwareAnsys HFSS

Live Webinar: Wyzwania w projektowaniu nowoczesnych systemów bezzałogowych: systemy radiokomunikacyjne

webinar Simulation TechnologyAnsys MechanicalAnsys Mechanical FEA Software

Live Webinar: Structural Design Optimization with Ansys Mechanical

article ElectrificationPower ElectronicsSimulation TechnologySustainabilityHigh-TechConsumer Product SimulationElectronic Design & Electromagnetics Simulation SoftwareAnsys Motor-CAD Electric Motor Design SoftwareFluid Simulation (CFD) SoftwareAnsys CFXAnsys Mechanical FEA SoftwareAnsys MaxwellAnsys IcepakAnsys SIwaveAnsys HFSSResearch Projects

E2PACKMAN: Strengthening Europe’s Microelectronics Value Chain

EDRMedeso is part of E2PACKMAN, a European Chips JU project focused on advancing next-generation electronic packaging technologies and strengthening Europe’s

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