Ansys Icepak
Ansys Icepak® (electronics cooling simulation software) is an electronics-specific simulation tool for the thermal design management and cooling of electronics product. Based on Ansys Fluent® (fluid simulation software) CFD solver, Ansys Icepak® is capable of predicting temperature, airflow and heat transfer in printed circuit boards, IC packages, power electronics, and electronics assemblies.
Thermal Design Management
With the ability to handle both mechanical and electrical CAD model, Ansys Icepak® facilitates the solving of challenging thermal management problem and electronics products and systems.
Being a part of the Ansys Electronics Desktop (AEDT)™ (electronics systems design platform) enables Ansys Icepak® to couple and utilize multiphysics aspects of electronics design and is able to include electromagnetic loss densities and be part of an electronics reliability workflow for predicting temperature rise in tight connection with Ansys SIWave™ (printed circuit board (PCB) and package electromagnetics simulation software), Ansys Mechanical™ (structural finite element analysis software) and Ansys Sherlock™ (electronics reliability prediction software).
Key Features
Ansys Icepak® includes all models for heat transfer, including conduction, convection, and radiation for both steady state and transient analysis. Key Features include:
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal modeling.
- Package charaterization
Benefits
Accurate Thermal Simulations
Ansys Icepak® can accurately simulate the thermal behavior of electronic components and systems, helping engineers to optimize their designs for better performance and reliability.
Faster Design Iterations
With Ansys Icepak®, engineers can quickly test and optimize their designs without the need for expensive physical testing.
Cost Savings
By optimizing designs with Ansys Icepak®, engineers can potentially reduce material and manufacturing costs, and improve the overall efficiency of their products.
Comprehensive Design Capabilities
Ansys Icepak® offers a comprehensive set of design capabilities, including 2D and 3D thermal simulations, coupled thermal and structural analysis, and multiphysics simulation, enabling engineers to evaluate the impact of different design choices on system performance.
Testimonials
The course was great! The trainer was amazing.
— Training Course / Imaging System Design with Ansys Zemax OpticStudio
Very good training. Got answers to all the questions I had.
— Training Course / Ansys Discovery Flow Simulation for Design Engineers
The course was excellent and exceeded my expectations in many ways. The instruction was clear, and the materials were well structured and easy to understand. The instructor was knowledgeable and encouraging. The course structure was logical, and the assignments were a nice addition to the course. Furthermore, the time limits and schedules were clear, which helped maintain a good pace and keep track of progress. Thank you for the great course!
— Training Course / Modelling and Preprocessing with Ansys Discovery
The training program proved to be beneficial. The lecturer was very knowledgeable about the subjects, and any questions or doubts were encouraged. Many workshop projects lead to fresh conversations and the sharing of ideas with others
— Training Course / Ansys Mechanical Basic Structural Nonlinearities
Very good instructor both regarding software knowledge and general FEM competence. And a good teacher
— Training Course / Structural mechanics simulation with Ansys Mechanical
Amazing format!
A good mix of topics.
Good venue, nice collegial atmosphere 😊
— Attendees 2025 / Gothenburg
The practical demonstrations were great!
— Attendee 2025 / Tampere
It was actually a perfect event with interesting subjects.
— Attendee 2024 / Gothenburg
