Ansys Icepak
Ansys Icepak® (electronics cooling simulation software) is an electronics-specific simulation tool for the thermal design management and cooling of electronics product. Based on Ansys Fluent® (fluid simulation software) CFD solver, Ansys Icepak® is capable of predicting temperature, airflow and heat transfer in printed circuit boards, IC packages, power electronics, and electronics assemblies.
Thermal Design Management
With the ability to handle both mechanical and electrical CAD model, Ansys Icepak® facilitates the solving of challenging thermal management problem and electronics products and systems. Being a part of the Ansys Electronics Desktop (AEDT)™ (electronics systems design platform) enables Ansys Icepak® to couple and utilize multiphysics aspects of electronics design and is able to include electromagnetic loss densities and be part of an electronics reliability workflow for predicting temperature rise in tight connection with Ansys SIWave™ (printed circuit board (PCB) and package electromagnetics simulation software), Ansys Mechanical™ (structural finite element analysis software) and Ansys Sherlock™ (electronics reliability prediction software).
Key Features
Ansys Icepak® includes all models for heat transfer, including conduction, convection, and radiation for both steady state and transient analysis. Key Features include:
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal modeling.
- Package charaterization
Benefits
Accurate Thermal Simulations
Ansys Icepak® can accurately simulate the thermal behavior of electronic components and systems, helping engineers to optimize their designs for better performance and reliability.
Faster Design Iterations
With Ansys Icepak®, engineers can quickly test and optimize their designs without the need for expensive physical testing.
Cost Savings
By optimizing designs with Ansys Icepak®, engineers can potentially reduce material and manufacturing costs, and improve the overall efficiency of their products.
Comprehensive Design Capabilities
Ansys Icepak® offers a comprehensive set of design capabilities, including 2D and 3D thermal simulations, coupled thermal and structural analysis, and multiphysics simulation, enabling engineers to evaluate the impact of different design choices on system performance.
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Testimonials
You’re transitioning through a whole range of different speeds and altitudes and it’s really important that your vehicle is stable. We looked at which software could model anything from sea level up to hypersonic speeds and Ansys won that trade-off with its computational fluid dynamics (CFD) and Ansys Fluent in terms of what range it can simulate and what kind of geometry it can handle.
— Andrew Bacon, Co-Founder and CTO / Space Forge
We were enrolled in course Applied Computational Fluid Dynamics and during the course a representative from EDRMedeso held a fantastic workshop and provided support during our projects.
— Love Sundström and Paloma Torrico / Students at KTH Royal Institute of Technology
Ever since we became an EDRMedeso customer I’ve never had any complaints. The support response time is always fast and when we have a time-critical issue, I can pick up the phone and get help instantly. That has been super helpful and brought added value to us here at Bruks Siwertell.
— Zoltan Habony / Bruks Siwertell
With Rescale we have huge computational power available and the possibility to run many analyzes in parallel, so this means we can do quicker design iterations and finalize our designs quicker.
— David Engerberg / Modvion
No doubt about that we can save time. You can have the results in a couple of hours instead of over the night.
— Jesper Thesbjerg / Stiesdal
The integrated electronic-photonic workflow provided by Ansys to co-design and co-simulate Silicon Photonics and CMOS chips is an indispensable tool to speed up our design process and results in better chips with fewer errors and a shorter time to market
— Jinsung Youn, Research Scientist - Large-Scale Integrated Photonics / Hewlett Packard Labs
The speed and accuracy provided by OpticStudio has made us more confident about the full performance of our optomechanical designs. We’ve used Ansys Zemax, for over 15 years. We’re always pleased with the tools they present for helping optical engineers work together effectively.
— Milan Matela, Senior R&D Optical Designer / Meopta-optika s.r.o.
Because Ansys Speos allows us to use our 3D CAD product as an add-on, we can perform a simulation without sacrificing the accuracy. This is one of the key aspects we liked.
— Asami Yonezawa, Senior Specialist - Mazda Craftsmanship Development Group / Mazda Motor Corporation
